Fraunhofer Institute for Surface Engineering and Thin Films IST
Fabrication of a TEM lamella from a silicon layer etched into pyramids using a focussed ion beam (FIB).
Targeted material cross-sections on the microscale using Focussed Ion Beam (FIB)
Functionality of the Focussed Ion Beam (FIB)
The combination of scanning electron microscope (SEM) and focused ion beam (FIB) makes it possible to specifically cut into material on the smallest scale (nanometer range) and directly image the material structure below the surface. This allows, for example, the precise localisation and chemical analysis (EDX) of local faults. This works for almost any material in a solid state, whether soft or extra hard, polymers, metals, ceramics, textile fibers, wood, etc.c.
Areas of use
- Local cross-sections e.g. at defect sites such as thin-layer growth defects, corrosion, trapped particles, etc.
- TEM lamella preparation
- High-resolution cross-sectional investigations in transmission (STEM)
- 3D tomography of the microstructure or local defects
- Writing of structures by means of targeted material removal
The Focussed Ion Beam (FIB) device ”Cross-Beam 340” from Zeiss is used for the preparation of local cross sections and TEM lamellae. Equipment: Ga ion source (1-30keV), FE Schottky emitter, detectors: In-Lense, SE, BSE, STEM and EDX, micromanipulator, PtC precursor, variable pressure mode, plasma cleaner, large airlock.
Cross-section through an ingrown particle
Optical multilayers of alternating SiO2 and Ta2O5 layers. Below the surface, an overgrown Si particle of around 2 µm diameter can be seen.
Section through particle
Precision section through a particle of battery material Li(NiMnCo)O2 (NMC111) to show the internal pore structure.
TEM lamella preparation
In addition to cross-sections, TEM lamellae can also be prepared. These are wafer-thin slices cut vertically from the surface.
STEM image and EDX mapping of a low-E layer system
STEM image and EDX mapping of low-E film system.
Transmission (Scanning Transmission Electron Microscopy) achieves a particularly high resolution which makes the inner structure of the material visible, e.g. by means of crystal orientation contrast.
3D tomography
Serial sections through a local defect site. By means of serial sections, microscale 3D tomography of the microstructure is obtained.